FPC / Maumaututū-Flex (agavaʻa)
PCB maumaututū (agavaʻa)
FPC / Maumaututū-Flex (agavaʻa)
| Faitauga o vaega | 1-28 faaputuga |  |
| Laminates ituaiga | FR-4 (High Tg, Halogen Free, High Frequency) PTFE, BT, Getek, Alumini faʻavae ， Apamemea faʻavae ， KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Mafiafia laupapa | 6-240mil | |
| Max Base mamafa 'apamemea | 210um (6oz) mo totonu vaega 210um (6oz) mo fafo vaega | |
| Min masini lapisi drill | 0.2mm (0.008 ″) | |
| Vaega Fua Faʻatusatusa | 12: 1 | |
| Tele vaega Max | Sigle itu poʻo itu faʻalua: 500mm * 1200mm, | |
| Multilayer faaputuga: 508mm X 610mm (20 ″ X 24 ″) | ||
| Min laina lautele / avanoa | 0.076mm / 0.076mm (0.003 ″ / 0.003 ″) / 3mil / 3mil | |
| Via ituaiga pu | Tauaso / Tanu / Faʻapipiʻi (VOP, VIP…) | |
| HDI / Microvia | IOE | |
| Faʻauma luga | HASL | |
| Taʻitaʻi Free HASL | ||
| Faʻatofuina Gold (ENIG), Immersion apa, Immersion Silver | ||
| Organic Solderability Preservative (OSP) / ENTEK | ||
| Malamalama auro (plating auro faigata) | ||
| ENEPIG | ||
| Filifili Gold Plating, Auro mafiafia e oʻo i le 3um (120u ") | ||
| Gold tamatamai lima, Carbon Print, Peelable S / M. | ||
| Lanu ufimata ufimata | Green, Blue, White, Black, Clear, ma isi | |
| Faʻaletonu | Nofoaga tasi, eseʻesega, coplanar impedance pulea ± 10% | |
| Otootoga maeʻa ituaiga | Routing CNC; V-Faʻailoga / Oti; Punch | |
| Faapalepale | Min Hole faapalepale (NPTH) ± 0.05mm | |
| Min Hole faapalepale (PTH) ± 0.075mm | ||
| Min Mamanu faʻapalepale ± 0.05mm |
PCB maumaututū (agavaʻa)
| Faʻavasega | Aitema | Malosiaga |  |
|
| Faitauga o vaega | Maopoopo-flex PCB | 2 ～ 14 | ||
| Flex PCB | 1 ～ 10 | |||
| Komiti Faatino | Min. Mafiafia | 0.08 +/- 0.03mm | ||
| Max. Mafiafia | 6mm | |||
| Max. Tele | 485mm * 1000mm | |||
| Pu ma le faʻasologa | Min. Pu | 0.15mm | ||
| Min.Slot Faʻamau | 0.6mm | |||
| Vaega Fua Faʻatusatusa | 10: 1 | |||
| Lolomi | Min. Lautele / Avanoa | 0.05 / 0.05mm | ||
| Faapalepale | Lolomi W / S. | ± 0.03mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Le pu i le pu | ± 0.075mm | |||
| Itu pu | ± 0.075mm | |||
| Faʻaletonu | 0, Aoga ≤ 50Ω: ± 5Ω 50Ω ≤ Taua: ± 10% Ω | |||
| Meafaitino | Faʻamatalaga Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | ||
| ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Basefilm Autu tagata faʻatau | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Faamatalaga Coverlay | PI: 2mil 1mil 0.5mil | |||
| LPI Lanu | Green / Yellow / White / Black / Blue / Red | |||
| PI Faigata | T: 25um ～ 250um | |||
| FR4 Faigata | T: 100um ～ 2000um | |||
| SUS Faigata | T: 100um ～ 400um | |||
| AL Faigata | T: 100um ～ 1600um | |||
| Faapipii | 3M / Tesa / Nitto | |||
| EMI talita | Ata tifaga / Apamemea / Silver vaitusi | |||
| Faʻauma luga | OSP | 0.1 - 0.3um | ||
| HASL | Sn: 5um - 40um | |||
| HASL (Leed leai se totogi) | Sn: 5um - 40um | |||
| ENEPIG | Ni: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| Au: 0.015 - 0.10um | ||||
| Palama auro malo | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 1um | ||||
| Auro emo | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 0.1um | ||||
| ENIG | Ni: 1.0 - 6.0um | |||
| Au: 0.015um - 0.10um | ||||
| Immesion siliva | Ag: 0.1 - 0.3um | |||
| Apamemea apa | Sn: 5um - 35um | |||